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Suneast WBD2200 IC Bonder

Placement accuracy:        ±15um@3σ

Placement anqle accuracy:        ±0.1°@3σ

Wafer size(mm):        4"/6"/8"(Option:12")

Die size(mm):        0.25*0.25mm~10*10mm

Substrate size(mm):        L150×W50~L300×W100

Substrate thickness(mm):        0.1~2mm

Placement head:        0-360°rotation/Auto change nozzle(option)

Placement pressure(N):        30~7500kg

Force control accuracy:        30g-250g:±10g;  250g-7500g:±5%

Glue feeding mode:        Support:dispensing, dipping glue, painting glue

Core motion module:        Linear motor+grating scale

Platform base of machine:        Marble platform

Loading/unloading:        Manual/auto

Machine dimension(L×W×H):        1255mm×1625mm×1610mm

*Remarks: Customization is supported



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